This article explains why circuit boards are usually green because green is the color of the solder mask, which is located at the top of the component.[Read More]

This article introduces a tutorial on multi-layer PCB design and some key points to consider when planning the stacking of circuit board layers.[Read More]

This article describes the defects and causes in the PCB assembly process.[Read More]

This article introduces the solder required for SMT patching, the advantages and disadvantages of these solder materials, and their applicable scenarios.[Read More]

This article compares the roles of ERP and MES systems in enterprises in terms of functions, scope, data types, and target audiences.[Read More]

This article analyzes the SMT assembly industry from opportunities, challenges, and future trends. It provides solutions to the problems of SMT factories.[Read More]

This article introduces the SMT assembly strength of yt-electronic from the advantages of component processing and case studies of cooperative companies.[Read More]

This article compares the differences between SMT and THT and concludes that the fundamental difference between SMT and THT lies in their assembly methods.[Read More]

This article talks about the challenges faced by SMT technology in circuit board assembly and how we should face these challenges.[Read More]

This article compares the advantages and disadvantages of SMT and DIP packaging and their applicable scenarios and gives advice on choosing SMT or DIP.[Read More]