HDI PCB
Interconnect PCBs with high density are an efficient way to increase the space on your printed circuit boards and make them faster. Most companies who use printed circuit boards can easily see the benefits of this.
HDI PCBs are one of the fastest growing segments in the printed circuit boards market. HDI PCBs can be designed with finer lines, spaces, smaller capture pads and vias, as well as higher pad density. This is due to the higher circuitry density. High-density boards have blind vias, buried vias, and microvias as small as.006 inches.
Key HDI PCB Benefits
Engineers now have more design flexibility and freedom than ever thanks to the evolution of high density PCB technology. HDI high density methods allow designers to place more components both on the front and back of the PCB. An HDI PCB allows designers to have more space and place components closer together. A high-density PCB with interconnects will result in a faster signal transmission and better signal quality.
HDI PCBs are widely used in order to reduce weight and dimensions, as well to improve the electrical performance of devices. High-density circuit boards are regularly used in mobile phones, touch screen devices, laptop computers and digital cameras, as well as 4G network communication. HDI PCBs are also widely used in electronic components and parts of aircraft, medical devices and other electronic products. High-density PCB technology offers almost unlimited possibilities.
HDI PCB Applications
HDI PCBs can be used in a variety of industries. You'll find HDI PCBs in all kinds of digital devices like smartphones and tablet computers, where the miniaturization of the device is crucial to its effective use. High-density PCBs are also used in aircraft, automobiles and other vehicles that use electronics.
The medical industry is one of the key areas where high-density PCBs are making huge strides. Only HDI PCBs are able to provide the small packages and high transmission rates needed by medical devices. A medical implant, for example, must be small enough to fit inside the body. However, any electronics in this implant must allow high-speed transmission of signals. HDI PCBs are a real blessing in this case. HDI PCBs are also useful for other medical equipment like CT scanners, emergency room monitors and more.
Yt-electronic can help you understand how high-density PCBs will improve the quality of electronics that you use or produce. We will let you know whether you are on the right path and how an HDI PCB could benefit your industry. You can then decide whether to move forward.
High Density, Impeccable PCBs
Over the course of a decade in business, yt-electronic has established a hard-earned reputation for manufacturing PCBs of the highest quality. Our custom PCB manufacturing capabilities enable you to get the finest quality HDI PCBs at competitive prices without min order quantity requirement. Our team run design for manufacture check on your custom PCB file and consult with you to ensure it is ready for manufacturing and that your boards will meet your performance requirements. We also have an on-site quality control department to verify the finished product meet your high quality standards.
Check out the table below for HDI PCBs in different structures.
HDI Structures |
Type of Micro vias |
Mass Production |
Small-Middle Batch |
Prototype | Available |
1+N+1 | Blind vias | Yes | Yes | Yes | 4 layers+ |
2+N+2 | Blind/Buried staggered vias |
Yes | Yes | Yes | 6 layers+ |
2+N+2 | Blind/Buried stacked vias |
Yes | Yes | Yes | 6 layers+ |
3+N+3 | Blind/Buried staggered vias |
/ | Yes | Yes | 8 layers+ |
3+N+3 | Blind/Buried stacked vias |
/ | / | Yes | 8 layers+ |
Review the table below to see our HDI PCB capabilities.
Feature | Capability |
Quality Grade | Standard IPC 2 |
Number of Layers | 4 – 24layers |
Order Quantity | 1pc – 10000+pcs |
Build Time | 2days – 5weeks |
Material | FR4 standard Tg 140°C,FR4 High Tg 170°C, FR4 and Rogers combined lamination |
Board Size | Min 6*6mm | Max 457*610mm |
Board Thickness | 0.4mm – 3.0mm |
Copper Weight (Finished) | 0.5oz – 2.0oz |
Min Tracing/Spacing | 2.5mil/2.5mil |
Solder Mask Sides | As per the file |
Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
Silkscreen Sides | As per the file |
Silkscreen Color | White, Black, Yellow |
Surface Finish | HASL – Hot Air Solder Leveling Lead Free HASL – RoHS ENIG – Electroless Nickle/Immersion Gold – RoHS Immersion Silver – RoHS Immersion Tin – RoHS OSP – Organic Solderability Preservatives – RoHS |
Min Annular Ring | 4mil, 3mil – laser drill |
Min Drilling Hole Diameter | 6mil, 4mil – laser drill |
Max Exponents of Blind/Buried Vias | stacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected |
Other Techniques | Flex-rigid combination Via In Pad Buried Capacitor (only for Prototype PCB total area ≤1m²) |
Get a Quote for HDI PCB Manufacturing Service Now
Please click below to enter our HDIPCB quote page. Fill in your circuit specification. We will respond to you by email as soon as we can.