This article introduces SMT process specifications and common anomalies, including equipment specifications, material specifications, etc.[Read More]

This article introduces what is dual inline package(DIP) and what dip is used for and the workflow and technical application of DIP welding.[Read More]

This article introduces the advantages, classification, and production process of flexible PCB,and their differences from traditional PCB.[Read More]

This article compares the differences between SMT and THT insertion technology in terms of components, substrates, assembly processes, etc.[Read More]

This article will introduce how to use correctly the ball grid array rework station for BGA repair, helping you better master this technology.[Read More]

This article provides a detailed introduction to the process of PCBA, where each step is optimized to ensure completion in a short amount of time.[Read More]

This article introduces the characteristics of an RF printed circuit board, the materials required for an RF PCB, and the applications of an RF PCB.[Read More]

This article introduces the electronic components on PCB boards, including capacitors, etc., as well as the classification of electronic components on PCBs.[Read More]

This article introduces the advantages and applications of high-speed PCB and the factors that need to be considered in high-speed PCB design.[Read More]

This article introduces the basic knowledge of PCB, including the definition of PCB, classification of PCB, PCB manufacturing, and PCB professional terminology.[Read More]