Introduction

The SMT mounting process is one of the most important processes in the manufacturing of electronic products.

Components and PCB can absorb moisture when stored and transported.

To remove moisture, it is necessary to bake the SMT before processing.

To ensure the quality of your product, you should avoid defects like bubbles, board bursts and blistering.

What Is the Purpose of SMT Baking?

SMT material baking has the primary goal of removing moisture from the material in order to achieve the following results:

• Avoid defects like bubbles, plate explosion, and blistering during welding.

• Welding reliability can be improved.

• Increase the lifespan of the product

The Steps of Baking SMT Material

Follow these steps to bake SMT materials:

1. Prepare Materials

Clean the SMT material before baking to remove dirt, dust and other contaminants.

Packaging and transportation are important for fragile components.

2. Set Baking Parameters

Baking parameters include baking temperature, baking time, baking method, etc.

The type of material, the storage conditions and the baking temperature are all factors that determine the baking time and temperature.

In general, the PCB baking temperature ranges from 110 to 125 degrees Fahrenheit, with a baking time of 2-8 hours.

The IC temperature ranges from 125-150 degrees and the baking time can be anywhere between 4-24 hours.

3. Bake

Place the materials evenly in the oven, and maintain a distance from the heat source to allow the hot air to circulate.

It is important to monitor the material changes and detect abnormalities as soon as possible.

Baked SMT Materials: Precautions

1. Set Baking Temperature and Time

Temperature and baking time should be adjusted according to the material type and storage environment.

The material can be damaged by a high or low temperature.

The material can become too dry if the baking time is prolonged. This will have an adverse effect on the welding process.

2. Cleaning and Maintaining Your Oven

To ensure the best baking results, it is important to clean and maintain your oven regularly.

To avoid any interference with conduction heating, the oven should be clean.

To ensure accuracy, calibrate the temperature control system of the oven.

3. Monitor the Humidity Level and Temperature in the Oven

The oven should keep a certain amount of moisture in order to avoid over-drying the material.

To get the best results, keep the temperature of the oven at a constant level.

Conclusion

Baking SMT materials is an important process in SMT manufacture and is crucial to ensuring product quality.

To achieve the desired baking result, it is important to strictly follow the instructions.