Y&T Technology Development Co.,Ltd

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PCB ∨∧
PCB Assembly ∨∧
Featured Parts
Manufacturers
Blog
About Us
FAQ?
Contact Us
Quote∨∧

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Categories Parts

Integrated Circuit
GPS GSM Module
Computer Chip
Connector
Resistor and CAP
Relay
Switch
Inductance
Computer Accessory
LCD
Sensor
Optical Laser
Trimmer
Module
Fuse
LED
Filter
Crystal and Oscillator
Transformer
Power Supply
Memory Card
Cable Assembly
Audio Product
Fan
Programmer
Tool
Magnetic
Battery Product
Other

PCB Assembly Quote

With over 11 years&apos experience in precise PCB Assembly, we have the capabilities to assemble PCBs (from simple boards to extremely high-end boards) with superior quality, short lead time and good price. Submit your PCBA requirements here to get free assembly quotation within 24-48 hours! Contact us here if you have any questions.

* PCB File

* BOM File

Only zip,rar,xls,csv files accepted.

* BOM Name

* Quantity

Delivery Method

PCB

PCB Type

Choose pcb type

FR4
Flexible PCB
Flex-rigid PCB
Aluminum
Rogers
Other

Layers

the number of conductive layers

1layer
2layer
4layer
6layer
8layer
10layer
12layer
14layer
16layer
18layer
20layer
layer

Material Details

Base material for PCB

FR4-Standard Tg 140C
FR4-Tg 150C
FR4-High Tg 170C
FR4-High Tg 180C
FR4-Halogen-free
FR4-Halogen-free&High TG

* Board Type

The full board are by only one single board or be arrayed with the same or different PCBs

single unit
panel

* Board Size

Input the maximum width and height of the board

* Panel Size

Different Design in Panel

How many different design of PCBs in the panel

Route Process

How those boards connected in the panel

None
V-scoring/V-groove
Tab-routing/Milling
Both V-scoring and tab-routing

X-out Allowance in Panel

Bad PCBs existed in panel

--
Yes
None

Thickness (Finished Board)

Thickness for the finished PCB

0.5mm
0.6mm
0.8mm
1.0mm
1.2mm
1.6mm
2.0mm
2.5mm
3.2mm
mm

Surface Finish

Extra process to exposed copper to help solderability

HASL -Hot Air Solder Leveling
Lead Free HASL - RoHS
ENIG -Electroless Nickle/Immersion Gold - RoHS
Immersion Silver - RoHS
Immersion Tin - RoHS
OSP -Organic Solderability Preservatives - RoHS
None

Copper Weight (Finished Product)

1oz=35um 2oz=70um

35 um
70 um
105 um
140 um
175 um
210 um
420 um
512 um
None
um

Inner Layer Copper Weight

1oz=35um 2oz=70um

18 um
35 um
70 um
105 um
140 um
175 um
210 um
420 um

Soldermask

Coating material used to mask or to protect selected area

Both Sides
One Side
None

Soldermask Color

The color of coating material

Green
Blue
Red
Black
Yellow
White
None

Matt Color (only add to Green or Black)

None
Green Matt
Black Matt

Silkscreen Legend

Text that printed on board for component identification

1 side
2 side
None

Silkscreen Legend Color

The color of text printed

White
Black
Yellow
Red
None

Smallest Holes

The smallest size of hole

0.40mm
0.30mm
0.20mm
0.15mm
0.10mm

Min. Tracing/Spacing

The smallest width of any conductors/smallest distance between any two adjacent conductors

0.20mm
0.15mm
0.10mm

Impedance Control

Stiffener

None
Yes

If exist stiffener, please design them in your file.

Gold Fingers

None
Yes

Flex Part Thickness

Additional Options(UL/Date markings, gold fingers, impedance control, buried/blind vias...)

Type of stacked/staggered microvias

The number of interconnected layer in HDI PCB. e.g., 4 layer PCB has vias that connect layer 1 to layer 2, you can choose 1. If 4 layer has vias that connect layer 1 to layer 2, and vias that connect layer 2 to layer 3,you can choose 2.

None
1
2

Laser Drill

Microvias with diameter smaller than 0.15mm, laser tooling required for this kind of micorovia.

Yes
None

Inspection Standards

PCB quality level inspection standard

IPC 2
IPC 3

UL Marking

Marking of UL on board

None
Yes - add to top silkscreen
Yes - add to bottom silkscreen
Yes - add to top soldermask
Yes - add to bottom soldermask
Yes - add to top copper
Yes - add to bottom copper
Yes - as yt-electronic default

Date Code Marking

Marking of date code on board

None
Yes - add near to UL marking
Yes - add to top silkscreen
Yes - add to bottom silkscreen
Yes - add to top soldermask
Yes - add to bottom soldermask
Yes - add to top copper
Yes - add to bottom copper
Yes - as yt-electronic default

ENIG(thicker Au)

Non-standard thickness for Au of surface finishing Nickle/Immersion Gold - RoHS

None
Au 3-5 u'
Au >5 u'

Peelable Soldermask

Coating material could be removed after board through wave soldering

None
1 Side
2 Sides

Impedance Control

The resistance to the flow of current, represented by an electrical network of combined resistance, capacitance and inductance reaction, usually in high-frequency circuits

None
Yes as +-10%
Yes as +-5%

Gold Fingers

The gold-plated terminal of a card-edge connector

None
Yes

Gold Fingers Number

How many gold fingers (one piece at one side counted as one)

Gold Fingers Chamfer

broken corner of gold finger to eliminate an otherwise sharp edge

None
20°
30°
45°
60°

Edge Plating

None
Yes

Skip V-scoring

None
Yes

Carbon Mask

None
Yes

Kapton tape

None
Yes

Pressfit holes

None
Yes

Via in pad

None
Yes

Via filled with resin

None
Yes

Half-cut/Castellated Holes

None
Yes

Countersinks/Counterbores

None
Yes

Assembly

Custom Testing

Testing defined by customer own, testing instruction and tooling should be adviced in details.

IC Programming

The process of transferring a computor program into an integrated circuit.Our IC programming software is SmartPRO 5000U-Plus, supporting package DIP,PLCC,SOIC,QFP,TSOP,SON,EBGA,CSP, etc. Compiled file would be required.

Assembly Side(s)

Are the parts mounted on one side only or both sides?

Single side
Double sides

* Contact Person

Country

Phone

Company

* Email

* Verification Code

You have successfully provided the data, we will contact you as soon as possible after processing, please wait patiently.

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