PCB consists of a copper foil and a substrate that are bonded together. The substrates used in PCB are usually glass fiber (FR-4), resin (FR-3), or other materials. Adhesives are typically phenolic resin, epoxy and other materials.

Ceramic PCBs consist of metal oxide ceramics, such as aluminum oxides (Al 2O 3), aluminum nitrides (AlN), and beryllium oxides (BeO). The performance of PCB and 2 is very different.

Plate Rigidity

Chemical fibers are used to make PCBs. Their rigidity is inferior to ceramic substrates due to environmental, temperature and processing conditions. It has a lower thermal expansion coefficient, a stronger thermal stability, and is more suitable for harsher environments.

Thermal Performance

Ceramic substrates are excellent at dissipating heat and are ideal for devices with high power. Ordinary PCBs, however, are restricted by the material technology. They are less impressive than ceramic materials.

Insulation Properties

Ceramic substrates are highly resistant to high voltage and have good insulation properties. They can protect equipment and personal safety.

Strength Is Determined by the Bonding Strength of Ceramic Substrates and Copper Foils

Using adhesive technology, the copper foil won't fall off. This technology improves board reliability.

To summarize the ceramic substrate has superior performance. Due to its source of material, manufacturing process and market use, its price is higher than ordinary PCBs.