SMT vs. THT
Surface mount technology (SMT) is a popular production process in the electronics assembly industry. Mobile phones and computers, which require lightweight and high-volume production, are widely using SMT.
PCB assembly made from SMT has high density and light weight characteristics. It allows automated mass production.
Reflow soldering is used when the solder joints are in the same plane as the board surface.
The automotive electronics industry is not able to replace THT (Through Hole Technology), which is a technology that uses a through hole.
THT is gradually being replaced in the consumer electronics sector.
The PCBA produced by THT has components that are further apart and a larger board. Both sides of the PCB are covered with components and soldering joints.
Wave soldering or other soft soldering methods can be used to create reliable solder joints.
The fundamental difference between SMT and THT lies in the assembly methods: "sticking" and "insertion".
Though Hole Technology uses leaded component to establish mechanical and electric connections by inserting pins in pre-drilled holes and then wave soldering the other side.
As circuits get denser, however, the use leads limit the reduction in size of circuit board.
Surface Mounting Technology is the process of placing components that are suitable for surface mounting, such as sheet-like components and miniaturized components on a printed circuitboard surface. This depends on the circuit requirements.
This PCB assembly technique uses soldering techniques such as wave or reflow soldering to create electronic components that have certain functions.
SMT circuit boards have solder joints and components on the same side. Through holes are used to connect wires from both sides of the board. This increases assembly density.
In summary, SMT is a lightweight technology that offers mass production advantages, but THT has unrivalled advantages in certain specific applications.
SMT, the main electronic assembly technology in the world, will continue to expand as technology advances.