We have already discussed pre-reflow AOI. Today, we will talk about the post-reflow AOI. The inspection methods of pre-furnace AOI and Post-reflow AOI are the same.
Post-reflow AOI is performed after reflow soldering. Post-reflow AOI can effectively improve print circuit board quality and reliability.
Post-Reflow AOI: What Is Its Role?
The main function of the post-furnace inspection is to detect defects, such as missing or wrong parts, solder bridges, solder joints that are empty, solder joints that are cold, and solder joints with no solder.
Advantages of Post-reflow AOI
The following benefits are associated with AOI post-furnace:
The inspection is able to detect defects even after welding.
It can automate testing and increase testing efficiency. It can generate a testing report for easier management and traceability.
Post-Reflow AOI Application Scope
The scope of application for post-furnace AOI is:
Consumer electronics: Includes mobile phones, computers and televisions.
Industrial control products: For example, robots, automotive electronics, etc.
Medical devices: For example, pacemakers, MRIs, etc.
The Exact Location of Post-Reflow AOI
The location of the AOI post-furnace can be determined by the actual production situation.
In general, the post-reflow AOI is installed at the exit of the reflow oven to detect circuit boards that have been soldered.
Future Development of Post-Reflow AOI
Artificial Intelligence: AI helps post-furnace AOI to automatically detect and identify more complex welding defects.
3D technology for detection: This technology allows you to detect poor welds more accurately.
Big Data Analysis Technology: The use of big data analysis technology to improve efficiency and accuracy in post-furnace AOI.
The development of post-furnace AOI will be driven by these trends, which will help to improve the product quality and reliability.
