General Drying Process of SMT Chips
This article introduces the general process requirements for drying SMT chips, such as photos of vacuum packaging that do not require drying.
These are the general requirements for drying SMT chips:
1) Vacuum-packed Chips do not require drying.
2) The chip must be baked if the humidity indicator card on the chip shows a value greater than 20% RH
after it has been unpacked.
3) The vacuum package must be dried if it has been exposed to the air for over 72 hours prior to
production.
4) If there is no marking for drying, the ICs must be dried if the developer does not use ICs or if the
inventory isn’t online.
5) Shenzhen yt-electronic: The temperature controller and humidity controller should be set at 10%. The
drying time should exceed 48 hours and the actual moisture should be lower than 20%.
